intloko_ibhena1 (9)

Ubhaqo lwe-AOI ye-chip resistance capacitance/LED/SOP TO/QFN/QFP/BGA series products

Umzekelo: GR-600

I-AOI yamkela inkqubo yokwenziwa kwemifanekiso ephuhliswe ngokwayo, ukutsalwa kombala okhethekileyo kunye neendlela zokuhlalutya iimpawu, ezinokumelana ne-lead kunye neenkqubo ezingenalo i-lead, kwaye ibe nemiphumo emihle yokufumanisa kumacandelo e-DIP kunye neenkqubo zeglue ebomvu.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zemveliso

1.Isantya esichanekileyo sokufumanisa ngokukhawuleza;

2.Ikhamera yedijithali ephezulu yedijithali ekrelekrele,tyena umgangatho womfanekiso uzinzile kwaye unokwethenjelwa;

3.Easy.Flexible.Quick programming akunye nokulungiswa kweempazamo;

4.Ukuqaphela okuzenzekelayo kunye ne-A/B surubuso UPHAWU;

5.Isistim yokuchonga ibhakhowudi yekhamera;

Idatha ye-6.CAD ingenisa ngokuzenzekelayo amathala eencwadi ecandelo lokukhangela;

7.Isistim yokubeka i-automatic, iphucula kakhulu isantya sokucwangcisa;

8.Muti_function inkqubo yeenkcukacha-manani ye-SPC;

AOI Machine isicelo izinto

acsdv (1)
acsdv (2)
SMT resistive capacitance series

 acsdv (3)

Isibane bead series

 acsdv (4)

SOP TO series

 acsdv (5)

QFN series

 acsdv (6)

QFP series acsdv (7)
BGA series  acsdv (8)

Iinkcukacha eziSebenzayo

Inkqubo esebenzayo Emva koshicilelo lwe-SMT solder paste, OKANYE (i-wave soldering) phambi nasemva kokuphinda kufakwe i-solder
  

Indlela yokuvavanya

ukufunda umfanekiso wemibala, uhlalutyo lwamanani, ukuqondwa komlinganiswa ngokuzenzekelayo (OCR), uhlalutyo lomgama wombala, uhlalutyo lwe-IC bridging, uhlalutyo lomlinganiselo omnyama nomhlophe, uhlalutyo lokukhanya, uhlalutyo olufanayo
Inkqubo yokuthatha umfanekiso Faka umbala 3CCD ekrelekrele ikhamera yedijithali
Isigqibo 20μm, 15μm, 10μm
Inkqubo yokukhanyisa Inqaba esetyhula enobukhazikhazi obuphezulu obunemibala emithathu yokukhanya kwe-LED
Indlela yokucwangcisa Ucwangciso olukhawulezayo lwemanuwali, ukufunyanwa okuzenzekelayo kolungelelwaniso lwe-CAD lwecandelo lokungenisa ithala leencwadi
Izinto Zokuhlola Ukuprintwa kwe-Solder Paste: Ewe, Hayi, i-Skew, i-Tin encinci, i-Tin engaphezulu, iSekethe emfutshane, ungcoliseko;Ukuhlolwa kokudityaniswa kwe-Solder: itoti egqithisileyo okanye engonelanga, uqhagamshelo lwetoti, amaso enkcenkce, ungcoliseko lwefoyile yobhedu, ukuphononongwa kweplagi ye-solder edibeneyo
Ubuncinci bovavanyo lwecandelo 01005chip,0.25pitchICOR (0603chip,0.5pitchIC)
Inkqubo yamanani ye-SPC Rekhoda idatha yovavanyo yohlalutyo lwamanani, ukujonga umgangatho wokuvelisa kwifomathi yokuphuma kwe-Excel
Inkqubo yebhakhowudi Ikhamera ukuqaphela oluzenzekelayo
Inkqubo yokwenza Windows XP, Windows 7
Ulawulo LWERIMOTHI Ukusebenzisa inethiwekhi yokusebenza okude ukuze kube lula kunye nokukhawuleza ukuguqulwa kweprogram kunye nokusombulula ingxaki
Iziphumo zovavanyo Bonisa indawo ethile ye-NG ngokusebenzisa umboniso we-intshi we-22 intshi ye-LCD

Iiparamitha zenkqubo yoomatshini

Ubungakanani bePCB 25×25mm ~500×400mm
PCB ubukhulu 0.3 ~ 6mm
PCB ukugoba <3mm
PCB Ukuphakama Ngaphezulu≤40mm, Ngezantsi≤100mm
PCB Fixed indlela Ukudibanisa kunye
vula izinto ezizenzekelayo
X/Y inkqubo yokuqhuba I-AC servo motor drive
kunye Screw
Ukubeka ukuchaneka <10μm
Ukunikezwa Amandla I-AC 22OV±10% 50/60Hz 1KW
Ubushushu bendalo 10℃40℃
Ukufuma kokusingqongileyo 10~80%RH
Ubunzima 500KG
Ubungakanani 1100×935×1380mm

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  • Okulandelayo:

  • Bhala umyalezo wakho apha kwaye uwuthumele kuthi