Oomatshini be-AOI
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I-Automatic Optical Inspection Detector ye-AOI D-500 yokuhlola umatshini
IGreen Intelligent lishishini lesizwe lobugcisa obuphezulu obugxile kwindibano ezenzekelayo kunye nezixhobo zesemiconductor.
I-Green Intelligent igxile kwiinkalo ezintathu eziphambili: i-elektroniki ye-3C, amandla amatsha, kunye ne-semiconductors. Kwangaxeshanye, kwasekwa iinkampani ezine: Green Semiconductor, Green New Energy, Green Robot, and Green Holdings.
Iimveliso eziphambili: ukutshixa isikrufu esizenzekelayo, ukuhambisa okuzenzekelayo ngesantya esiphezulu, ukudibanisa okuzenzekelayo, ukuhlolwa kwe-AOI, ukuhlolwa kwe-SPI, i-soldering wave kunye nezinye izixhobo; izixhobo ze-semiconductor: umatshini wokudibanisa (ucingo lwe-aluminium, ucingo lobhedu).
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IsiXhobo sokuHlola esiZenzekayo se-AOI kumgca we-AOI GR-2500X
Iinzuzo zesixhobo se-AOI:
Ukukhawuleza ngokukhawuleza, ubuncinane amaxesha angama-1.5 ngokukhawuleza kunezixhobo ezikhoyo kwiimarike;
Izinga lokubhaqa liphezulu, kunye nomyinge wama-99.9%;
Ukungaqondi kakuhle;
Ukunciphisa iindleko zabasebenzi, ukwandisa kakhulu umthamo wemveliso kunye nenzuzo;
Ukuphucula umgangatho, ukunciphisa ukusebenza kakuhle kokutshintshwa kwabasebenzi kunye nenkcitho yexesha loqeqesho, kunye nokuphucula kakhulu umgangatho;
Uhlalutyo lomsebenzi, ukuvelisa ngokuzenzekelayo iitafile zokuhlalutya isiphene, ukuququzelela ukulandelwa kunye nokufumana ingxaki.
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Ubhaqo lwe-AOI ye-chip resistance capacitance/LED/SOP TO/QFN/QFP/BGA series products
Umzekelo: GR-600
I-AOI yamkela inkqubo yokwenziwa kwemifanekiso ephuhliswe ngokwayo, ukutsalwa kombala okhethekileyo kunye neendlela zokuhlalutya iimpawu, ezinokumelana ne-lead kunye neenkqubo ezingenalo i-lead, kwaye ibe nemiphumo emihle yokufumanisa kumacandelo e-DIP kunye neenkqubo zeglue ebomvu.
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In-line AOI(Automated Optical Inspector) detector GR-600B
Uluhlu lokuHlola lwe-AOI:
Ukuprintwa kwe-Solder paste: ubukho, ukungabikho, ukutenxa, i-tin eyaneleyo okanye egqithisileyo, isiphaluka esifutshane, ukungcoliswa;
Ukuhlolwa kwecandelo: iindawo ezilahlekileyo, ukutenxa, ukugoba, isikhumbuzo sokuma, ukuma kwecala, iinxalenye ezijikelezayo, ukuguqulwa kwe-polarity, iindawo ezingalunganga, ukugoba kwamacandelo e-AI, ibhodi yePCB izinto zangaphandle, njl.
Ukubonwa kwendawo ye-Solder: ukufunyanwa kwetoti egqithisileyo okanye engonelanga, uqhagamshelo lwetoti, amaso etoti, ukungcoliseka kwefoyile yobhedu, kunye neendawo zokubethelela zokufakela i-wave soldering.
