Isicelo

应用

I-Green Intelligent inikezela nge-matrix yemveliso ye-"5+1+2" ebanzi, ebandakanya i-laser soldering, i-glue dispensing, i-screw fastening, i-solder ekhethiweyo, i-AOI / i-SPI, izisombululo ezizenzekelayo ezizenzekelayo, izixhobo ze-semiconductor, kunye neenkqubo ezintsha zokushicilela ze-UV.

Izicelo zoShishino

IGREEN liShishini leSizwe eliPhezulu leTekhnoloji elizinikele kwi-R&D kunye nokuveliswa kwendibano ye-elektroniki ezenzekelayo kunye nokupakishwa kwe-semiconductor kunye nezixhobo zokuvavanya.Ukukhonza iinkokeli zoshishino ezifana ne-BYD, i-Foxconn, i-TDK, i-SMIC, i-Canadian Solar, i-Midea, kunye ne-20+ namanye amashishini e-Fortune Global 500. Iqabane lakho elithembekileyo kwizisombululo zokwenziwa kwemveliso.

3C Electronics

Isetyenziselwa ukuthengisa izinto ezahlukeneyo ze-elektroniki, ezinje nge-LED yombane, iiswitshi, iitshaja, iimveliso ze-electro-acoustic, iziguquli, iiPCB, kunye nezinye izinto, njl.

Funda ngokugqithisileyo

I-LED

Ukutywinwa kweLens ngokusasaza, i-solder yesekethe yomqhubi, iheatsink yokuqinisa ngezikrufu, ukuhlolwa kwetshiphu yi-AOI, kunye noqhagamshelo lwewafer ngoomatshini bokudibanisa.

Funda ngokugqithisileyo

Semiconductor

Ukuveliswa kwe-Semiconductor kuqinisekisa ukuthembeka kwe-chip ngokusebenzisa iinkqubo ezilawulwa ngokuqinileyo: ukuhlolwa kwe-AOI yangaphambili, i-mid-end bonding ye-interconnects, kunye nezixhobo zokupakisha ngasemva.

Funda ngokugqithisileyo

Izixhobo zonyango

Ukuthengiswa okuchanekileyo kwezixhobo zoluvo,Ukuqinisa izixhobo zokucinga,Uhlolo lweMicrochannel AOI,Ibhondi yeBiochip

Funda ngokugqithisileyo

Amandla amatsha

Ukusasaza, i-soldering, i-screw fastening, i-AOI, kunye ne-wire bonding - ezi teknoloji zintlanu zingundoqo ziqinisekisa ukhuseleko, ukusebenza kakuhle, kunye nokuqina kwizixhobo ezintsha zamandla.

 

Funda ngokugqithisileyo

I-Electronics yeemoto

Ukutywinwa kwe-ECU ngokusasaza, i-Laser soldering ye-sensor, i-Torque-controlled screw fastening yabalawuli bedomeyini, ukuhlolwa kwe-PCB ye-Automotive-grade yi-AOI, ukupakishwa kwemodyuli yamandla ngoomatshini bokudibanisa.

Funda ngokugqithisileyo

LIYINTONI ISHISHINI LAKHO ?

Inikezelwe ukubonelela nge-automated assembly kunye ne-semiconductor ukupakishwa kunye nezisombululo zokuvavanya

Zeziphi iindidi zesiXhobo soBukrelekrele be-Industria esinokubonelela ngazo kwiiProjekthi zakho?

1. Umatshini wokukhupha owenziwe ngesantya esiphezulu

2. Umatshini wokubethela ozenzekelayo

3. Umatshini wokuqinisa isikrufu ozenzekelayo

4. Umatshini wokuthambisa okhethiweyo

5. I-aluminium ye-semiconductor / i-copper wire bonder

6. I-AOI kunye nomatshini we-SPI

7. Izixhobo ze-Semiconductor kunye neenkqubo ezintsha zokushicilela ze-UV zamandla

8. Izisombululo ezizenzekelayo ezingezizo eziqhelekileyo

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