Solder Ball Laser Soldering Machine LAB201
Ukucaciswa kweNdlela
| Umzekelo | LAB201 | |
| Iiparamitha zeLaser | Amandla | 150W |
| Ubude bamaza | 1064 | |
| Imowudi | I-laser fiber fibers eqhubekayo | |
| Iimpawu zebhola ye-solder | 0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ngokuzithandela) | |
| Inkqubo yokubeka imbonakalo | CCD, isisombululo ± 5 um | |
| Iipikseli zekhamera | 5 million pixels | |
| Imo yokulawula | PLC+Ulawulo lwePC | |
| Ukuchaneka okuphindaphindwayo | Ubukhulu 0.02mm | |
| Uluhlu lokuqhubekekisa | 200mm*150mm(Yenzelwe wena) | |
| Amandla okusebenza | <2KW/H | |
| Umthombo womoya | Umoya ocinezelweyo>0.5 MPa nitrogen > 0.5 MPa | |
| Umda wangaphandle(L*W*H) | 1000*1100*1650(mm) | |
| Ubunzima | 500KG | |
Iimbonakalo
I-1.Isantya sokufudumeza sikhawuleza, kwaye indawo yokubeka ichanekile, enokugqitywa kwimizuzwana eyi-0.2;
2.Iibhola ze-solder zikhutshwe kwi-nozzle ekhethekileyo kwaye zigubungele ngokuthe ngqo iipads.
3.Akukho flux eyongezelelweyo okanye ezinye izixhobo ezifunekayo, akukho ngcoliseko lwendalo, ukwandisa ubomi bezixhobo zombane;
4.Ukuxhasa ubuncinci bedayamitha ye-0.15mm kwiibhola zetin, esi sixhobo se-laser tin ibhola ye-welding sihambelana nophuhliso lwezixhobo zokuvelisa ezidibeneyo kunye nezichanekileyo;
I-5.Iingxube ze-solder ezahlukeneyo zinokudityaniswa ngokukhetha ubungakanani bebhola ye-solder;
6.Umgangatho we-welding ozinzileyo kunye nezinga eliphezulu lesivuno;
7.Bambisana nenkqubo yokubeka iCCD ukuhlangabezana neemfuno zemveliso enkulu kwimigca yendibano;
I-8.UPH ≥ 8000 amaphuzu, isivuno ≥ 99% (enxulumene nezinto eziphathekayo kunye nokuhambelana).








