High Precision Duplex Laser Solder Ball Ball Welding Machine

Ukuchaneka okuphezulu kweDuplex Laser Solder Ball Machine Welding Machine Featured Image

Umatshini we-laser soldering yinkqubo echanekileyo ephezulu echanekileyo esebenzisa iteknoloji yelaser ukujoyina amacandelo e-elektroniki kunye ne-solder. Ngokungafaniyo neendlela zemveli zokuthengisa (ezifana ne-ayini ye-soldering okanye i-wave soldering), ihambisa amandla e-laser agxininisiweyo ukutshisa i-solder ngokuchanekileyo, ukunciphisa uxinzelelo lwe-thermal kumalungu ajikelezileyo.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

IParameter yesixhobo

ixesha	ixabiso
Uhlobo	Umatshini wokuSoda
Imeko	Entsha
Amashishini asebenzayo	Ishishini le-fuse, ishishini le-semiconductor, ishishini lonxibelelwano
Ingxelo yoVavanyo koomatshini	Kubonelelwe
Uhlobo lweNtengiso	Imveliso eqhelekileyo
Iwaranti yamacandelo angundoqo	Iminyaka eyi-1.5
Amacandelo Angundoqo	I-PLC, iMoto, inqanawa yoxinzelelo
Indawo yokubonisa	Akukho nanye
Indawo yeMvelaphi	eTshayina
	Guangdong
Igama lebrand	LUHLAZA
I-Voltage	220V
Imilinganiselo	100110165(cm)
Ukusetyenziswa	i-soldering wire
Iwaranti	3Iminyaka
Amanqaku okuThengisa aPhambili	Ukuchaneka okuphezulu
Ubunzima (KG)	500KG
Umzekelo	LAB201
Iimpawu zebhola ye-solder	0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ngokuzithandela)
Inkqubo yokubeka imbonakalo	CCD, Isisombululo ±5um
Iipikseli zekhamera	5 million pixels
Imo yokulawula	PLC+Ulawulo lwePC
Ukuchaneka kokuphinda-phinda koomatshini	±0.02mm
Uluhlu lokuqhubekekisa	200mm * 150mm(Inokwenzeka ngokwezifiso)
Sebenzisa amandla	<2KW/H
Umthombo womoya	Umoya ocinezelweyo>0.5 MPa nitrogen>0.5MPa
Ubume bangaphandle(LW*H)	100011001650(mm)

Iimpawu zesixhobo

1. Inkqubo yokufudumeza kunye ne-droplet ikhawuleza kwaye ingagqitywa ngaphakathi kwe-0.2s;

2. Gqibezela ukunyibilika kwebhola ye-solder kwi-solder nozzle ngaphandle kokutshiza;

3. akukho flux, akukho ngcoliseko, ukwandisa ubomi bezixhobo zombane;

4. Ubuncinci bebhola ye-solder yi-0.15mm, ehambelana nenkqubela phambili yokudibanisa kunye nokuchaneka;

5. I-Welding yamacandelo ahlukeneyo e-solder inokugqitywa ngokukhethwa kobukhulu bebhola ye-solder;

6. Umgangatho we-welding ozinzileyo kunye nenqanaba lesivuno esiphezulu;

7. Ukusebenzisana ne-CCD yokubeka inkqubo ukuhlangabezana neemfuno zemveliso yobuninzi bomgca wendibano;

8. UPH > 8000 amanqaku, isivuno > 99% (yahlukileyo ngokwemveliso eyahlukileyo)

Indawo yosetyenziso

Ikhamera ye-CCM / imodyuli, umnwe wegolide / i-FPC, ucingo, isixhobo sonxibelelwano, isixhobo sokukhanya, ishishini le-fuse, i-semiconductor industry solder

Uluhlu lweSicelo

I-Laser solder ibhola ye-welding ibona iklasi echanekileyo: i-PCB pad kunye noqhagamshelwano lwe-solder yegolide, i-FPC kunye ne-PCB yokuwelda, intonga yocingo kunye

PCB welding, inxalenye THT plug-in isixhobo soldering. Iimveliso ezinezikhonkwane ze-PIN kwelinye icala kwaye zihambelane neemveliso ezine-PIN pin zombini

amacala, kunye nezinye iimveliso zokuwelda ezichanekileyo.