Ukuchaneka okuPhezulu okuLuhlaza okuSonga i-Soldering koomatshini abaSebenzayo kwiNkqubo yeDuplex yeLaser Solder Ball Welding Machine

Ukuchaneka okuPhezulu okuLuhlaza okuSoldering koomatshini abazenzekelayo Inkqubo yeDuplex yeLaser Solder Ball Welding Machine Featured Image

IGreen Intelligent lishishini lesizwe lobugcisa obuphezulu obugxile kwindibano ezenzekelayo kunye nezixhobo zesemiconductor.

I-Green Intelligent igxile kwiinkalo ezintathu eziphambili: i-elektroniki ye-3C, amandla amatsha, kunye ne-semiconductors. Kwangaxeshanye, kwasekwa iinkampani ezine: Green Semiconductor, Green New Energy, Green Robot, and Green Holdings.

Iimveliso eziphambili: ukutshixa isikrufu esizenzekelayo, ukuhambisa okuzenzekelayo ngesantya esiphezulu, ukudibanisa okuzenzekelayo, ukuhlolwa kwe-AOI, ukuhlolwa kwe-SPI, i-soldering wave kunye nezinye izixhobo; izixhobo ze-semiconductor: umatshini wokudibanisa (ucingo lwe-aluminium, ucingo lobhedu).

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

IParameter yesixhobo

ixesha	ixabiso
Uhlobo	Umatshini wokuSoda
Imeko	Entsha
Amashishini asebenzayo	Ishishini le-fuse, ishishini le-semiconductor, ishishini lonxibelelwano
Ingxelo yoVavanyo koomatshini	Kubonelelwe
Uhlobo lweNtengiso	Imveliso eqhelekileyo
Iwaranti yamacandelo angundoqo	Iminyaka eyi-1.5
Amacandelo anguNdoqo	I-PLC, iMoto, inqanawa yoxinzelelo
Indawo yokubonisa	Akukho nanye
Indawo yeMvelaphi	eTshayina
	Guangdong
Igama lebrand	LUHLAZA
I-Voltage	220V
Imilinganiselo	100110165(cm)
Ukusetyenziswa	i-soldering wire
Iwaranti	3Iminyaka
Amanqaku okuThengisa aPhambili	Ukuchaneka okuphezulu
Ubunzima (KG)	500KG
Umzekelo	LAB201
Iimpawu zebhola ye-solder	0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ngokuzithandela)
Inkqubo yokubeka imbonakalo	CCD, Isisombululo ±5um
Iipikseli zekhamera	5 million pixels
Imo yokulawula	PLC+Ulawulo lwePC
Ukuchaneka kokuphinda-phinda koomatshini	±0.02mm
Uluhlu lokuqhubekekisa	200mm * 150mm(Inokwenzeka ngokwezifiso)
Sebenzisa amandla	<2KW/H
Umthombo womoya	Umoya ocinezelweyo>0.5 MPa nitrogen>0.5MPa
Ubume bangaphandle(LW*H)	100011001650(mm)

Iimpawu zesixhobo

1. Inkqubo yokufudumeza kunye ne-droplet ikhawuleza kwaye ingagqitywa ngaphakathi kwe-0.2s;

2. Gqibezela ukunyibilika kwebhola ye-solder kwi-solder nozzle ngaphandle kokutshiza;

3. akukho flux, akukho ngcoliseko, ukwandisa ubomi bezixhobo zombane;

4. Ubuncinci bebhola ye-solder yi-0.15mm, ehambelana nenkqubela phambili yokudibanisa kunye nokuchaneka;

5. I-Welding yamacandelo ahlukeneyo e-solder inokugqitywa ngokukhethwa kobukhulu bebhola ye-solder;

6. Umgangatho we-welding ozinzileyo kunye nenqanaba lesivuno esiphezulu;

7. Ukusebenzisana ne-CCD yokubeka inkqubo ukuhlangabezana neemfuno zemveliso yobuninzi bomgca wendibano;

8. UPH > 8000 amanqaku, isivuno > 99% (yahlukileyo ngokwemveliso eyahlukileyo)

Indawo yosetyenziso

Ikhamera ye-CCM / imodyuli, umnwe wegolide / i-FPC, ucingo, isixhobo sonxibelelwano, isixhobo sokukhanya, ishishini le-fuse, i-semiconductor industry solder

Uluhlu lweSicelo

I-Laser solder ibhola ye-welding ibona iklasi echanekileyo: i-PCB pad kunye noqhagamshelwano lwe-solder yegolide, i-FPC kunye ne-PCB yokuwelda, intonga yocingo kunye

PCB welding, inxalenye THT plug-in isixhobo soldering. Iimveliso ezinezikhonkwane ze-PIN kwelinye icala kwaye zihambelane neemveliso ezine-PIN pin zombini

amacala, kunye nezinye iimveliso zokuwelda ezichanekileyo.