kwi-1 I-Solder paste i-Dispenser kunye ne-Laser Spot Soldering Machine GR-FJ03
Ukucaciswa kweNdlela
Umzekelo | GR-FJ03 |
Imo yokusebenza | Iyazenzekela |
Indlela yokondla | Ukutya ngezandla |
Indlela yokusika | Ukusika ngesandla |
Ukubetha kwezixhobo | (X1/X2) 250*(Y1/Y2) 300*(Z1/Z2)100(mm) |
Isantya sokuhamba | 500mm/s (ubuninzi 800mm/s |
Uhlobo lwemoto | Servo motor |
Ukuphindaphinda | ±0.02 mm |
Izinto zokugcwalisa | Intlama yesolder |
Dot solder inkqubo yokulawula uncamathisele | Ikhadi lokulawula intshukumo+umdwelisi wenkqubo ophathwa ngesandla |
Inkqubo yokuwelda kweLaser | Ikhompyuter yeshishini + ikhibhodi kunye nemouse |
Uhlobo lweLaser | I-laser ye-semiconductor |
Ubude beLaser | 915nm |
Ubuninzi bamandla laser | 100W |
Uhlobo lweLaser | I-laser eqhubekayo |
IFayibha Core Diameter | 200/220um |
soldering esweni real-time | Ukujongwa kwekhamera ye-coaxial |
Indlela yokupholisa | Ukupholisa umoya |
Isikhokelo | Uphawu lwaseTaiwan |
Isikruru intonga | Uphawu lwaseTaiwan |
Iiswitshi zombane | Omron/Taiwan uphawu |
Indlela yokubonisa | Ukubeka iliso |
Indlela yokutya ye-tin | Ukhetho |
Imowudi yokuqhuba | I-Servo motor+ isikrufu esichanekileyo+ nesikhokelo esichanekileyo |
Amandla | 3KW |
Ukunikezwa Amandla | AC220V/50HZ |
Ubungakanani | 1350*890*1720MM |
Iimbonakalo
1.Esi sixhobo se-laser sisixhobo se-axis emithandathu - oomatshini ababini badityaniswa ngamagxa egxalaba njengomatshini omnye, ukuphumeza umsebenzi wokuhambisa intlama ye-solder kwelinye icala kunye ne-laser soldering kwelinye icala;
I-2.I-othomathikhi ye-solder paste yokukhupha inkqubo ilawula i-solder paste ehambisa nge-Musashi echanekileyo yokulawula i-dispensing controller, enokulawula ngokuchanekileyo ubungakanani betoti enikeziweyo;
I-3.I-laser solder paste solder system ixhotyiswe ngomsebenzi wempendulo yeqondo lokushisa, engalawuli kuphela ukushisa kwe-solder, kodwa iphinde ibeke iliso kwindawo yokushisa;
I-4.Inkqubo yokubeka iliso ebonakalayo isebenzisa imifanekiso ukuze ibone ngokuzenzekelayo imeko ye-solder yemveliso;
I-5.I-Laser solder paste i-soldering luhlobo lwe-solder engabonakaliyo, engavelisi uxinzelelo okanye umbane osisigxina njenge-iron contact soldering. Ngoko ke, umphumo we-laser soldering uphuculwe kakhulu xa kuthelekiswa nentsimbi yendabuko;
I-6.Laser solder paste i-soldering ifudumeza kuphela iipads ezidibeneyo ze-solder, kwaye zinempembelelo encinci ye-thermal kwibhodi ye-solder kunye nomzimba wecandelo;
I-7.I-solder ixutywe ngokukhawuleza kwiqondo lokushisa elimiselweyo, kwaye emva kokufudumeza kwendawo, isantya sokupholisa i-solder joint fast, yenza i-alloy layer ngokukhawuleza;
I-8.Isantya sempendulo yobushushu obukhawulezayo: iyakwazi ukulawula ngokuchanekileyo ubushushu ukuze ihlangabezane neemfuno ezahlukeneyo ze-solder;
I-9.I-laser processing precision iphezulu, indawo ye-laser incinci (uluhlu lwendawo lunokulawulwa phakathi kwe-0.2-5mm), inkqubo inokulawula ixesha lokucubungula, kwaye ukuchaneka kuphezulu kunendlela yenkqubo yendabuko. Kufanelekile ukuthengiswa kwamacandelo amancinci achanekileyo kunye neendawo apho iindawo zokubethelwa zithinteka kakhulu kwiqondo lokushisa
10.Umqadi omncinci we-laser uthatha indawo yencam yentsimbi, kwaye kulula ukusetyenzwa xa kukho ezinye izinto eziphazamisayo kumphezulu wenxalenye esetyenziweyo.