intloko_ibhena1 (9)

kwi-1 I-Solder paste i-Dispenser kunye ne-Laser Spot Soldering Machine GR-FJ03

Ncamathelisa i-Laser Soldering

Inkqubo yokuwelda i-solder ye-laser ilungele i-PCB / i-FPC yesiqhelo, i-pad line kunye nezinye iintlobo zeemveliso.

Indlela yokucubungula i-solder paste welding laser inokuqwalaselwa ukuba imfuno echanekileyo iphezulu kwaye indlela ye-manual inzima ukuyifezekisa.

 


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukucaciswa kweNdlela

Umzekelo GR-FJ03
Imo yokusebenza Iyazenzekela
Indlela yokondla Ukutya ngezandla
Indlela yokusika Ukusika ngesandla
Ukubetha kwezixhobo (X1/X2) 250*(Y1/Y2) 300*(Z1/Z2)100(mm)
Isantya sokuhamba 500mm/s (ubuninzi 800mm/s
Uhlobo lwemoto Servo motor

Ukuphindaphinda

±0.02 mm

Izinto zokugcwalisa

Intlama yesolder

Dot solder inkqubo yokulawula uncamathisele

Ikhadi lokulawula intshukumo+umdwelisi wenkqubo ophathwa ngesandla

Inkqubo yokuwelda kweLaser

Ikhompyuter yeshishini + ikhibhodi kunye nemouse

Uhlobo lweLaser

I-laser ye-semiconductor

Ubude beLaser

915nm

Ubuninzi bamandla laser

100W

Uhlobo lweLaser

I-laser eqhubekayo

IFayibha Core Diameter

200/220um

soldering esweni real-time

Ukujongwa kwekhamera ye-coaxial

Indlela yokupholisa

Ukupholisa umoya

Isikhokelo

Uphawu lwaseTaiwan

Isikruru intonga

Uphawu lwaseTaiwan

Iiswitshi zombane

Omron/Taiwan uphawu

Indlela yokubonisa

Ukubeka iliso

Indlela yokutya ye-tin

Ukhetho

Imowudi yokuqhuba

I-Servo motor+ isikrufu esichanekileyo+ nesikhokelo esichanekileyo

Amandla

3KW

Ukunikezwa Amandla

AC220V/50HZ

Ubungakanani

1350*890*1720MM

 

Iimbonakalo

1.Esi sixhobo se-laser sisixhobo se-axis emithandathu - oomatshini ababini badityaniswa ngamagxa egxalaba njengomatshini omnye, ukuphumeza umsebenzi wokuhambisa intlama ye-solder kwelinye icala kunye ne-laser soldering kwelinye icala;

I-2.I-othomathikhi ye-solder paste yokukhupha inkqubo ilawula i-solder paste ehambisa nge-Musashi echanekileyo yokulawula i-dispensing controller, enokulawula ngokuchanekileyo ubungakanani betoti enikeziweyo;

I-3.I-laser solder paste solder system ixhotyiswe ngomsebenzi wempendulo yeqondo lokushisa, engalawuli kuphela ukushisa kwe-solder, kodwa iphinde ibeke iliso kwindawo yokushisa;

I-4.Inkqubo yokubeka iliso ebonakalayo isebenzisa imifanekiso ukuze ibone ngokuzenzekelayo imeko ye-solder yemveliso;

I-5.I-Laser solder paste i-soldering luhlobo lwe-solder engabonakaliyo, engavelisi uxinzelelo okanye umbane osisigxina njenge-iron contact soldering. Ngoko ke, umphumo we-laser soldering uphuculwe kakhulu xa kuthelekiswa nentsimbi yendabuko;

I-6.Laser solder paste i-soldering ifudumeza kuphela iipads ezidibeneyo ze-solder, kwaye zinempembelelo encinci ye-thermal kwibhodi ye-solder kunye nomzimba wecandelo;

I-7.I-solder ixutywe ngokukhawuleza kwiqondo lokushisa elimiselweyo, kwaye emva kokufudumeza kwendawo, isantya sokupholisa i-solder joint fast, yenza i-alloy layer ngokukhawuleza;

I-8.Isantya sempendulo yobushushu obukhawulezayo: iyakwazi ukulawula ngokuchanekileyo ubushushu ukuze ihlangabezane neemfuno ezahlukeneyo ze-solder;

I-9.I-laser processing precision iphezulu, indawo ye-laser incinci (uluhlu lwendawo lunokulawulwa phakathi kwe-0.2-5mm), inkqubo inokulawula ixesha lokucubungula, kwaye ukuchaneka kuphezulu kunendlela yenkqubo yendabuko. Kufanelekile ukuthengiswa kwamacandelo amancinci achanekileyo kunye neendawo apho iindawo zokubethelwa zithinteka kakhulu kwiqondo lokushisa

10.Umqadi omncinci we-laser uthatha indawo yencam yentsimbi, kwaye kulula ukusetyenzwa xa kukho ezinye izinto eziphazamisayo kumphezulu wenxalenye esetyenziweyo.


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