ISemiconductor IC isiXhobo sokuBonding/iAluminium Wedge Bonding Machine GR-W01

ISemiconductor IC isiXhobo sokuBonding/iAluminiyam iWedge yokuBonding Machine GR-W01 Umfanekiso oFakelweyo

Iibhetri zamandla amatsha, ii-photovoltaic inverters, ii-elektroniki zeemoto, ukugcinwa kwamandla, i-IGBT, iibhodi zokulawula ukhuseleko lwebhetri ye-BMS, njl.

Lo matshini wokudibanisa ucingo unokuhambelana ne-aluminiyam kunye ne-copper bonding;

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Uphawu lweMveliso

● Hlanganisa iingcingo ezishinyeneyo kunye nemicu kwiqonga elinye lomatshini kunye nokutshintsha inkqubo ekhawulezayo;
● Ngokusebenzisa ulawulo lwenkqubo ye-welding, i-welding parameters inokulungelelaniswa ngexesha langempela lomgangatho wezinto eziguqukayo ukuze kuqinisekiswe umgangatho we-welding ophindaphindiweyo;
●Inkqubo yokwenza izinto elubala ngokudibana ngokungenamthungo ngokwemigaqo yoShishino 4.0/OT;
● Ukufumana eyona nto ihambelanayo yezinto eziphathekayo ngeendlela ezahlukeneyo ze-ultrasonic frequencies ukukhetha kuzo, kunye nokukhuthaza ukuzinza kwenkqubo;
● Ukuhlanganiswa kweteknoloji yenkqubo kunye ne-automation ukusuka kumthombo omnye wokubonelela.