Umatshini wokuBonga ngocingo
-
ISemiconductor IC isiXhobo sokuBonding/iAluminium Wedge Bonding Machine GR-W01
Iibhetri zamandla amatsha, ii-photovoltaic inverters, ii-elektroniki zeemoto, ukugcinwa kwamandla, i-IGBT, iibhodi zokulawula ukhuseleko lwebhetri ye-BMS, njl.
Lo matshini wokudibanisa ucingo unokuhambelana ne-aluminiyam kunye ne-copper bonding;
-
Umatshini wokuBonding weAluminiyam we-TO Series yokuBonding ngocingo -Wedge Bonding ICs/GR-W02
Umqolo omnye ukuya kumatshini okhethekileyo wokubopha ucingo;
I-GR-W02 ngumatshini wokudibanisa ucingo olulungele izixhobo zombane, imveliso ihambelana nomgca omnye ukuya kwi-multi-row ye-ultrasonic yokupakishwa kunye noyilo, i-bonder isetyenziswe emva kwenani elikhulu lokuphucula okuphindaphindiweyo, usebenzisa ii-motor linear ezizinzile nezithembekileyo, ii-motor coil voice, iinkqubo ze-ultrasonic zokuvelisa. Ukongeza, ipateni eyandisiweyo yokuqaphela isakhono sesixhobo ibonelela ngemveliso ekhokelayo kwishishini kunye nokuthembeka.
