Umatshini wokuBonga ngocingo
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ISemiconductor IC isiXhobo sokuBonding/iAluminium Wedge Bonding Machine GR-W01
Iibhetri zamandla amatsha, ii-photovoltaic inverters, ii-elektroniki zeemoto, ukugcinwa kwamandla, i-IGBT, iibhodi zokulawula ukhuseleko lwebhetri ye-BMS, njl.
Lo matshini wokudibanisa ucingo unokuhambelana ne-aluminiyam kunye ne-copper bonding;
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Umatshini wokuBonding weAluminiyam we-TO Series wokuBonding ngocingo -Wedge Bonding ICs/GR-W02
Umqolo omnye ukuya kumatshini okhethekileyo wokubopha ucingo;
I-GR-W02 ngumatshini wokudibanisa ucingo olufanelekileyo kwizixhobo zamandla, imveliso ihambelana nomqolo omnye ukuya kwi-multi-row yokupakisha kunye noyilo lwe-ultrasonic, i-bonder isetyenziswe emva kwenani elikhulu lokuphucula okuphindaphindiweyo, usebenzisa ii-motor linear ezizinzileyo nezithembekileyo, ikhoyili yezwi. iimotor, iinkqubo ze-ultrasonic zokuvelisa. Ukongeza, ipateni eyandisiweyo yokuqaphela isakhono sesixhobo ibonelela ngemveliso ekhokelayo kwishishini kunye nokuthembeka.
